SDSX established in 2017, the company is headquartered in Shenzhen and has subsidiaries in Beijing, Chengdu, Wuxi, and other locations. Both the Shenzhen headquarters and the Chengdu R&D center are equipped with high-specification anti-static clean laboratories, covering a total area of over 5,000 square meters. These laboratories are equipped with numerous advanced testing systems and customized reliability testing devices. Additionally, the company has established advanced module equipment production bases in Chengdu and Wuxi, which can provide customers with high-performance and highly reliable products in a long-term, stable, and efficient manner.

The company specializes in providing comprehensive solutions for first-generation Si RF, second-generation GaAs, and third-generation GaN semiconductor chips and module equipment. The R&D team consists of over 150 members, including senior experts from well-known domestic and international companies such as Qorvo, NXP, Infineon, and HuaRun Microelectronics. All team members have more than 10 years of rich industry experience. The company has successfully developed over 2,000 types of chips, among which hundreds of chips have been widely applied in various key domestic projects and model-fitting programs, effectively breaking the foreign technological monopoly and achieving import substitution. For example, the star-loaded eight-beam 32-channel chip was successfully manufactured in the first run; the airborne silicon-based four-channel multifunctional chip has been equipped in dozens of aircraft with zero product failures.