Chip and Module R&D Capabilities
Monolithic Microwave Integrated Circuit (MMIC) Chip
Monolithic Microwave Integrated Circuit (MMIC) Chip

SDSX offers RF chips, Modules, and solutions based on Si RF, GaAs, and GaN processes.    Its products include power amplifiers, low-noise amplifiers, driver amplifiers, RF switches, limiters, power dividers, equalizers, attenuators, power management chips, multifunction chips, and more.

Discrete Devices
Discrete Devices

Our discrete device products cover a power range of 2W to 2000W.

High-integration Modules
High-integration Modules

SDSX have the R&D capability for multi - channel SIP modules across C, X, Ku, K, and Ka bands.

SDSX can design and develop brick - style and tile - style T/R components.

Reliability Testing Capabilities
Temperature Cycling Test (TCT)
Temperature Cycling Test (TCT)
High Temperature Operating Life (HTOL)
High Temperature Operating Life (HTOL)
High Temperature Reverse Bias (HTRB)
High Temperature Reverse Bias (HTRB)
High Temperature Gate Bias (HTGB)
High Temperature Gate Bias (HTGB)
Helium Mass Spectrometer Leak Detection System (MSLD)
Helium Mass Spectrometer Leak Detection System (MSLD)
Fluorocarbon Leak Test Equipment
Fluorocarbon Leak Test Equipment
UHAST
UHAST
High-Specification Laboratories
High-Specification Laboratories
High-Specification Laboratories
High-Specification Laboratories

Shenzhen SDSX Technology Co., Ltd. operates high-specification laboratories spanning 2,000 square meters at its Shenzhen Headquarters R&D Center and 3,000 square meters at the Chengdu R&D Center, featuring ESD-protected cleanrooms and equipped with dozens of advanced test systems including vector network analyzers, spectrum analyzers, and wafer probe stations.   In collaboration with Southeast University, we established a specialized RF Integrated Circuit and Systems Laboratory.   These facilities deliver comprehensive validation capabilities encompassing product performance characterization, packaging integrity verification, reliability testing, and Automated Test Equipment (ATE) qualification, supported by full-process reliability platforms for HTRB (High Temperature Reverse Bias), HTGB (High Temperature Gate Bias), HAST (Highly Accelerated Stress Test), and HTOL (High Temperature Operating Life) testing with real-time data recording functionality.

Chengdu Automated Module Production Line
Chengdu Automated Module Production Line