Low-noise amplifier (LNA) chips, as the core components of wireless communication receivers, directly determine communication quality and distance. In satellite-to-ground communication networks, due to the large volume of data transmission, long transmission distances, severe atmospheric attenuation, and limited power supply available for ground terminals, especially mobile ones, the LNA chips used in ground terminal receivers have stringent requirements for noise figure and power consumption. Recently, SDSX has launched an InGaAs LNA chip, model SX2204, operating in the 17–22 GHz frequency range. At room temperature, it features a noise figure as low as 0.9 dB, a gain of 27 dB, a gain flatness of ±0.5 dB, and a power consumption of only 65 mW per chip, achieving top-tier industry performance.

Additionally, the Ka-band GaN power amplifier chip for ground terminal transmitters has also been developed and will be released soon. In the future, it will be used in conjunction with the LNA chip. With the gradual networking of China's low-Earth-orbit satellite network, ground terminals will be deployed in large quantities. Currently, more and more ground terminals are adopting phased array systems, with hundreds of RF chips used in each terminal. The demand for RF chips in ground terminals is enormous. The RF chips for satellite communication ground terminals developed by SDSX can meet the huge market demand for satellite communication and contribute to the realization of a high-speed, high-quality, low-cost, and stable satellite communication network.