Phased array antenna systems are composed of hundreds to thousands of radiating elements arranged in a specific pattern. In active phased array systems, each radiating element is connected to an independent T/R (transmit/receive) channel. By amplifying, phase-shifting, and attenuating the RF microwave signals within these channels using external control signals, beamforming and electronic scanning can be achieved. Therefore, T/R modules are the core components of active phased array antennas, enabling the system to “see” farther, cover a wider area, and offer more flexible functions.

SDSX has developed a series of RF microwave chips, T/R modules, and microsystems for phased array antenna systems. The newly launched SX7006 series is a 0.5W four-channel Ku-band SiP (System in Package) module, which is part of the T/R module product family and is suitable for communication and radar applications. The module integrates a low-noise amplifier for reception, a power amplifier for transmission, and beamforming functions, as well as six-bit phase shifting, six-bit attenuation, serial-to-parallel conversion, and power modulation. The SX7006 operates in the 14–18 GHz frequency range, with a transmit saturated output power of 27 dBm, a receive gain greater than 27 dB, and a noise figure of 2.8 dB. The overall dimensions are no larger than 15 mm × 15 mm, and the weight is less than 5 grams.

The pins of the SX7006 module are brought out using a double-sided BGA (ball grid array) solder ball arrangement, suitable for reflow soldering installation processes. Moreover, the double-sided BGA pin configuration of the T/R module provides a shorter interconnection path with the antenna, reducing the number of connectors and minimizing connection losses, thereby achieving higher EIRP (Equivalent Isotropic Radiated Power) and G/T (Gain-to-Noise Temperature) values.

The SX7006 series products feature a metal-ceramic hermetic package, meeting high-reliability usage requirements. Compared with traditional T/R component processes, SiP-packaged chip integrated modules offer higher consistency, eliminating the need for tuning, and are more suitable for mass production, assembly, and use. This will save users a significant amount of time and labor costs. Currently, the SX7006 series products have been mass-produced and delivered to customers.